Which statement about bonding in electrical systems is correct?

Which statement about bonding in electrical systems is correct?

• A. Bonding connects metal enclosures and equipment frames to equalize potentials and prevent dangerous voltages.
• B. Bonding increases thermal conduction.
• C. Bonding stores charge.
• D. Bonding reduces signal latency.

Answer: (A)

Bonding is the practice of tying metal parts together with a low-impedance conductor so they sit at the same electrical potential. This equalization prevents dangerous voltage differences between metal enclosures and equipment frames, which could shock someone or cause arcing if touched or if a fault occurs. By ensuring all these conductive parts are at the same potential, bonding helps safety during fault conditions and supports reliable operation of protective devices. That statement captures the essential purpose of bonding. It isn’t about increasing heat transfer, storing charge, or affecting signal timing, so those options don’t describe bonding’s role.

Bonding is the practice of tying metal parts together with a low-impedance conductor so they sit at the same electrical potential. This equalization prevents dangerous voltage differences between metal enclosures and equipment frames, which could shock someone or cause arcing if touched or if a fault occurs. By ensuring all these conductive parts are at the same potential, bonding helps safety during fault conditions and supports reliable operation of protective devices.

That statement captures the essential purpose of bonding. It isn’t about increasing heat transfer, storing charge, or affecting signal timing, so those options don’t describe bonding’s role.